Copper sulphate is the primary copper metal source used in acid copper electroplating baths. It provides Cu²⁺ ions required to produce smooth, levelled, highly conductive and bright copper deposits on steel, zinc die-cast, brass and PCB components.

Chemical Details  

• Chemical name: Copper Sulphate Pentahydrate

• Formula: CuSO₄·5H₂O

• Appearance: Blue crystalline solid

• Copper metal content: ~24–25% Cu

• Solubility: Highly soluble in water

Purity: Electroplating grade, low iron & chloride Function in Electroplating Bath Copper sulphate acts as the main copper source in acid copper plating systems. Key Roles

• Supplies Cu²⁺ ions for copper deposition.

• Controls plating speed and current efficiency.

• Enables high conductivity and uniform metal distribution.

• Supports bright, levelled and ductile copper coatings.